operating parameter self-feedback method for chemical mechanical lapping device and system for controlling the same

The invention posts an operation recipe automatic feedback method for a CMP device. The steps of the invention comprises: firstly, lifetime of consumable parts in the CMP device is downloaded to a database which comprises a fist reference list and a second reference list; secondly, a wafer thickness...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHUANG ZHIHAO, ZENG SHENGHUAN, ZHUANG QIANYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS POLISHING REGULATING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention posts an operation recipe automatic feedback method for a CMP device. The steps of the invention comprises: firstly, lifetime of consumable parts in the CMP device is downloaded to a database which comprises a fist reference list and a second reference list; secondly, a wafer thickness profile value corresponding to the consumable parts lifetime in the CMP device is searched out via the first reference list in the database; thirdly, an optimal operation parameter of the CMP device is searched out via the wafer thickness profile value and the second reference list in the database; fourthly, the optimal operation parameter is uploaded to the CMP device.