Sealing board and method for producing the same

A sealing board (30) for sealing a container containing an electronic component constituted of a base formed of a material exhibiting low wettability to a brazing filler metal (31) and having a metal layer exhibiting high wettability to the brazing filler metal (31) formed on the surface, a brazing...

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Bibliographische Detailangaben
Hauptverfasser:	HIRATSUKA HARUYUKI, KASAI TAKAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A sealing board (30) for sealing a container containing an electronic component constituted of a base formed of a material exhibiting low wettability to a brazing filler metal (31) and having a metal layer exhibiting high wettability to the brazing filler metal (31) formed on the surface, a brazing filler metal portion formed so as to form a closed region on the metal layer, and an exposed portion where the surface of the base is exposed at at least a part of the closed region. Since at least a part of the sealing board becomes the exposed portion, a sealing board with brazing filler metal for packaging can be produced inexpensively with stabilized quality.