Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth
Disclosed is a cleaning-free water-based flux for constraining compound growth of solder joint interface, relating to a material for welding, in particular to a cleaning-free water- based flux that is used in the welding of micro-electronics and can constrain the compound growth of the solder joint...
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| creator | LIU XINGJUN ZHANG JINBIN WANG CUIPING ZHANG WEI MA YUNQING HUANG YIXIONG LIN SHUNMAO |
| description | Disclosed is a cleaning-free water-based flux for constraining compound growth of solder joint interface, relating to a material for welding, in particular to a cleaning-free water- based flux that is used in the welding of micro-electronics and can constrain the compound growth of the solder joint interface. The invention provides a cleaning-free water-based flux, which can be effectively matched with solder without lead, with shiny welding points, good welding effect and good interface property, and can prevent the metal compound growth and constrain the compound growth of the solder joint interface. According to weight percent, the components are as following: organic reductant 0.1 percent to 0.3 percent; agent for constraining metal compound growth 0.01 percent to 1 percent; active organic manure 0.2 percent to 3 percent; surfactant 0.1 percent to 3 percent; corrosion inhibitor 0.1 percent; cosolvent 5 percent to 30 percent; the rest is water. |
| format | Patent |
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The invention provides a cleaning-free water-based flux, which can be effectively matched with solder without lead, with shiny welding points, good welding effect and good interface property, and can prevent the metal compound growth and constrain the compound growth of the solder joint interface. According to weight percent, the components are as following: organic reductant 0.1 percent to 0.3 percent; agent for constraining metal compound growth 0.01 percent to 1 percent; active organic manure 0.2 percent to 3 percent; surfactant 0.1 percent to 3 percent; corrosion inhibitor 0.1 percent; cosolvent 5 percent to 30 percent; the rest is water.</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080116&DB=EPODOC&CC=CN&NR=101104231A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080116&DB=EPODOC&CC=CN&NR=101104231A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU XINGJUN</creatorcontrib><creatorcontrib>ZHANG JINBIN</creatorcontrib><creatorcontrib>WANG CUIPING</creatorcontrib><creatorcontrib>ZHANG WEI</creatorcontrib><creatorcontrib>MA YUNQING</creatorcontrib><creatorcontrib>HUANG YIXIONG</creatorcontrib><creatorcontrib>LIN SHUNMAO</creatorcontrib><title>Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth</title><description>Disclosed is a cleaning-free water-based flux for constraining compound growth of solder joint interface, relating to a material for welding, in particular to a cleaning-free water- based flux that is used in the welding of micro-electronics and can constrain the compound growth of the solder joint interface. The invention provides a cleaning-free water-based flux, which can be effectively matched with solder without lead, with shiny welding points, good welding effect and good interface property, and can prevent the metal compound growth and constrain the compound growth of the solder joint interface. 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The invention provides a cleaning-free water-based flux, which can be effectively matched with solder without lead, with shiny welding points, good welding effect and good interface property, and can prevent the metal compound growth and constrain the compound growth of the solder joint interface. According to weight percent, the components are as following: organic reductant 0.1 percent to 0.3 percent; agent for constraining metal compound growth 0.01 percent to 1 percent; active organic manure 0.2 percent to 3 percent; surfactant 0.1 percent to 3 percent; corrosion inhibitor 0.1 percent; cosolvent 5 percent to 30 percent; the rest is water.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth |
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