Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth

Disclosed is a cleaning-free water-based flux for constraining compound growth of solder joint interface, relating to a material for welding, in particular to a cleaning-free water- based flux that is used in the welding of micro-electronics and can constrain the compound growth of the solder joint interface. The invention provides a cleaning-free water-based flux, which can be effectively matched with solder without lead, with shiny welding points, good welding effect and good interface property, and can prevent the metal compound growth and constrain the compound growth of the solder joint interface. According to weight percent, the components are as following: organic reductant 0.1 percent to 0.3 percent; agent for constraining metal compound growth 0.01 percent to 1 percent; active organic manure 0.2 percent to 3 percent; surfactant 0.1 percent to 3 percent; corrosion inhibitor 0.1 percent; cosolvent 5 percent to 30 percent; the rest is water.