Printed circuit board and method for manufacturing a solderless electrical connection

The board (2) has several pressing sockets (8) for holding pressing pins (10) of an electronic component. The pressing pins can be inserted into passage openings of the pressing sockets in a press fit manner from a broad side of the circuit board. An isolating protection section (40) is attached on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FASSEL REINHARD, HEJNA HARALD, GOETTEL THOMAS
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The board (2) has several pressing sockets (8) for holding pressing pins (10) of an electronic component. The pressing pins can be inserted into passage openings of the pressing sockets in a press fit manner from a broad side of the circuit board. An isolating protection section (40) is attached on a part of the broad side of the printed circuit board. The protection section has passage openings (42) for the pressing pins, where the passage openings of the section lie over passage openings (18) of the pressing sockets, where the protection section consists of plastic-foil. An independent claim is also included for a method for establishing a solderless electrical connection between the printed circuit board and a component.