Structure with metal trace interconnect component embedded in surface of dielectric material and its manufacturing method

A multilayer interconnect element (22) is provided which includes at least one dielectric element (20) in which metal interconnect patterns (12, 12a) and (13, 13a) are exposed at an outer surface (24, 26) thereof, the metal interconnect patterns having outer surfaces (21, 21a) which are co-planar with an exposed outer surface (24, 26) of the dielectric element. In addition, multilayer interconnect elements (72) are provided in which second interconnect elements (70), which do not have co-planar interconnect patterns are integrated therewith as intermediate elements, and the resulting multilayer interconnect element has co-planar interconnect patterns (86).