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A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ballof a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. Th...

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Bibliographische Detailangaben
Hauptverfasser:	DELL AMICO RODRIGUEZ JOSE MIGU, FERNANDEZ MARTIN FELIX, PEREZ CABRERA YUNIESKY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AGRICULTURE ANIMAL HUSBANDRY BEER BIOCHEMISTRY BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES, AS HERBICIDES CHEMISTRY COMPOSITIONS THEREOF CULTURE MEDIA ENZYMOLOGY FERTILISERS FERTILISERS CHARACTERISED BY THEIR FORM FISHING FORESTRY HUMAN NECESSITIES HUNTING MANUFACTURE THEREOF METALLURGY MICROBIOLOGY MICROORGANISMS OR ENZYMES MIXTURES OF FERTILISERS COVERED INDIVIDUALLY BY DIFFERENTSUBCLASSES OF CLASS C05 MIXTURES OF ONE OR MORE FERTILISERS WITH MATERIALS NOT HAVINGA SPECIFIC FERTILISING ACTIVITY, e.g. PESTICIDES,SOIL-CONDITIONERS, WETTING AGENTS MUTATION OR GENETIC ENGINEERING ORGANIC FERTILISERS NOT COVERED BY SUBCLASSES C05B, C05C, e.g. FERTILISERS FROM WASTE OR REFUSE PEST REPELLANTS OR ATTRACTANTS PLANT GROWTH REGULATORS PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTSTHEREOF PROPAGATING, PRESERVING OR MAINTAINING MICROORGANISMS SPIRITS TRAPPING VINEGAR WINE
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Beschreibung
Zusammenfassung:	A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ballof a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may beprovided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.