Photoresist compositions

The present invention relates to a photoresist composition which is suitable to make circuit of the LCD device, semiconductor integrated circuit and the like microcircuits, concretely it relates to a photoresist composition which includes the novolac resin represented by the following chemical formu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIN CHAE GHO, LEE GIE BEAM, KIM CHOO HEUCK, BYON CHAEL GEE, KIM MOON CHI, BYEON CHA HEUN, KIM DONG-MIN, KIM BYONG HOO, KIM CHONG WAN, KIM BYEONG WOOL, CHOE GEE CHI, PARK DAE YEON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photoresist composition which is suitable to make circuit of the LCD device, semiconductor integrated circuit and the like microcircuits, concretely it relates to a photoresist composition which includes the novolac resin represented by the following chemical formula 1, the diazo photosensitive chemical compound and the organic solvent. In the chemical formula 1, R represents hydrogen, hydroxyl group or methyl group, and n is the intact number from 3 to 20. The photoresist composition of the invention, as the novolac resin is added, is provided with excellent fire-resisting property and resolving capability, and can improve the homogeneity of the pattern. The novolac resin is polymerized by the aromatic alcohol, and the aromatic alcohol contains meta-cresol, para-cresol and resorcin.