Reduced electromagnetic coupling in integrated circuits

Disclosed are integrated circuits (700) having multiple electromagnetically emissive devices, such as LC oscillators (702, 204). The devices are formed on an integrated circuit substrate and are given different planar orientations from each other. Particular integrated circuit packages disclosed are''flip-chip'' packages, in which solder bumps (604) are provided on the integrated circuit substrate for flipping and mounting of the finished integrated circuit upon a printed circuit board or other substrate. The solder bumps provide conductive connections between the integrated circuit and the substrate. The orientations and positioning of the emissive devices are such that one or more of the solder bumps (604) are interposed between neighboring emissive devices (702, 704) to act as an electromagnetic shield between them.