Heat radiator
The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended pa...
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| creator | LU CUIJUN LIU SONGSHUI |
| description | The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended part passes the opening and blocks on the gap by its block ear. This invention is simple and reliable. |
| format | Patent |
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The extended part passes the opening and blocks on the gap by its block ear. This invention is simple and reliable.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSTRUMENT DETAILS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100825&DB=EPODOC&CC=CN&NR=101060764B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100825&DB=EPODOC&CC=CN&NR=101060764B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU CUIJUN</creatorcontrib><creatorcontrib>LIU SONGSHUI</creatorcontrib><title>Heat radiator</title><description>The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended part passes the opening and blocks on the gap by its block ear. This invention is simple and reliable.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSTRUMENT DETAILS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD1SE0sUShKTMlMLMkv4mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-hgaGBmYG5mYmTk7GRCkCAF1SHmY</recordid><startdate>20100825</startdate><enddate>20100825</enddate><creator>LU CUIJUN</creator><creator>LIU SONGSHUI</creator><scope>EVB</scope></search><sort><creationdate>20100825</creationdate><title>Heat radiator</title><author>LU CUIJUN ; LIU SONGSHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101060764BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSTRUMENT DETAILS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LU CUIJUN</creatorcontrib><creatorcontrib>LIU SONGSHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU CUIJUN</au><au>LIU SONGSHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat radiator</title><date>2010-08-25</date><risdate>2010</risdate><abstract>The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended part passes the opening and blocks on the gap by its block ear. This invention is simple and reliable.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Heat radiator |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T16%3A27%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LU%20CUIJUN&rft.date=2010-08-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN101060764BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |