Heat radiator

The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended pa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LU CUIJUN, LIU SONGSHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The heat dispersion device for electronic element comprises: a heat radiator, and a gusset plate with a gap-round through hole fixing the radiator on the electronic element, wherein the radiator includes some fins and a heat absorption extended part with clip ear opposite to the gap. The extended part passes the opening and blocks on the gap by its block ear. This invention is simple and reliable.