Method for local bonding silicon / glass by laser

This invention discloses a method for laser local bonding of silicon/glass. The method comprises: washing, performing a first activation, performing a second activation, pre-bonding, and laser heating. After surface activation treatment, glass and silicon wafer can be intimately bonded by laser loca...

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Bibliographische Detailangaben
1. Verfasser: TIELIN,LIAO SHI
Format: Patent
Sprache:eng
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