Photosensitive resin composition and photosensitive dry film by the use thereof

A photosensitive resin composition for h-ray exposure which has high sensitivity for h-ray and is excellent in resolution of a resist pattern, and a photosensitive dry film by the use thereof are provided. The photosensitive resin composition is composed of an alkali-soluble resin (A) having an alic...

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Bibliographische Detailangaben
1. Verfasser:	UEMATSU TERUHIRO,KATSUMATA NAOYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A photosensitive resin composition for h-ray exposure which has high sensitivity for h-ray and is excellent in resolution of a resist pattern, and a photosensitive dry film by the use thereof are provided. The photosensitive resin composition is composed of an alkali-soluble resin (A) having an alicyclic epoxy group-containing unsaturated compound in a part of a carboxyl group of a carboxyl group-containing acryl copolymer as well as having a weight-average molecular weight of 1,000 to 100,000, an ethylenically unsaturated compound (B) and a photopolymerization initiator (C) including at least a photopolymerization initiator (C1) whose absorption coefficient for light with a wavelength of 405 nm is 1 or more as an essential component.