Direct liquid injection system and method for forming multi-component dielectric films

The present invention provides methods and systems for atomic layer deposition (ALD). In some embodiments a system is provided comprising: at least one direct liquid injection system configured to inject one or more deposition precursors into one or more vaporization chambers, at least one bubble system configured to vaporize one or more deposition precursors; and a process chamber coupled to said direct liquid injection system and said bubblers system, said process chamber being configured to receive the deposition precursors from said direct liquid injection and bubbler systems and being adapted to carry out an ALD process. In an alternative embodiment, the system is comprised of two separate bubbler systems. In another alternative embodiment, the system is comprised of two separate direct liquid injection systems.