Semiconductor-sealing epoxy resin composition and semiconductor device sealed therewith

An epoxy resin composition for sealing a semiconductor containing the following (A) to (D) components: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) an inorganic filler, characterized in that it is substantially free of electroconductive metal foreign particles having a si...

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Bibliographische Detailangaben
1. Verfasser:	ETO TAKUYA,IKEMURA KAZUHIRO,TOYODA HIDESHI,NAKABAYASHI KATSUYUKI,TSUKAHARA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An epoxy resin composition for sealing a semiconductor containing the following (A) to (D) components: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) an inorganic filler, characterized in that it is substantially free of electroconductive metal foreign particles having a size of 20 m or more. The above epoxy resin composition does not contain electroconductive metal foreign particles having such a size that makes it impossible to detect and remove the metal foreign particles by the use of a conventional method for removing electroconductive metal foreign particles.