A method of forming a sterilised sensor package and a sterilised sensor package
A sensor package is provided comprising an implantable sensor having an electrode area and an electric contact area, the package comprising a shielding packaging enclosing at least the electrode area of the sensor while exposing the electric contact area. The sensor package fascilitates handling of...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A sensor package is provided comprising an implantable sensor having an electrode area and an electric contact area, the package comprising a shielding packaging enclosing at least the electrode area of the sensor while exposing the electric contact area. The sensor package fascilitates handling of the implantable sensor and provides for the possibility of sterilising the electric contact area leaving the electrode area protected. |
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