Core board comprising nickel layer, multilayer board and manufacturing method thereof

Core board comprising nickel layer, multilayer board and manufacturing method thereof

The present invention provides a core board and a manufacturing method thereof, in which the core board includes a nickel layer as a seed layer to improve the binding strength between an insulation layer and a conductive layer, so that it allows forming fine inner circuits by the semi-additive metho...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: JUNG SOON-OH,CHOI CHEOL-HO,NAM CHANG-HYUN,KIM HONG-WON,KIM SEUNGUL
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides a core board and a manufacturing method thereof, in which the core board includes a nickel layer as a seed layer to improve the binding strength between an insulation layer and a conductive layer, so that it allows forming fine inner circuits by the semi-additive method.