Chip bench of plasma reinforced thin film deposition device
The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated...
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| creator | FU SILIE CHEN JUNFANG LI WEI ZHANG MAOPING LI YUN |
| description | The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated ceramic; the fixed support is composed of metal housing, RF antenna and fixed flannel; the heatingpipe is jacketed by heat tungsten wire in the metal heating sleeve. The substrate heats itself evenly and control temperature, which changes internal stress of film and microcosmic structure to reachdifferent filming biased condition. |
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The substrate heats itself evenly and control temperature, which changes internal stress of film and microcosmic structure to reachdifferent filming biased condition.</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100908&DB=EPODOC&CC=CN&NR=101012551B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100908&DB=EPODOC&CC=CN&NR=101012551B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FU SILIE</creatorcontrib><creatorcontrib>CHEN JUNFANG</creatorcontrib><creatorcontrib>LI WEI</creatorcontrib><creatorcontrib>ZHANG MAOPING</creatorcontrib><creatorcontrib>LI YUN</creatorcontrib><title>Chip bench of plasma reinforced thin film deposition device</title><description>The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated ceramic; the fixed support is composed of metal housing, RF antenna and fixed flannel; the heatingpipe is jacketed by heat tungsten wire in the metal heating sleeve. 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The substrate heats itself evenly and control temperature, which changes internal stress of film and microcosmic structure to reachdifferent filming biased condition.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Chip bench of plasma reinforced thin film deposition device |
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