Chip bench of plasma reinforced thin film deposition device

The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FU SILIE, CHEN JUNFANG, LI WEI, ZHANG MAOPING, LI YUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated ceramic; the fixed support is composed of metal housing, RF antenna and fixed flannel; the heatingpipe is jacketed by heat tungsten wire in the metal heating sleeve. The substrate heats itself evenly and control temperature, which changes internal stress of film and microcosmic structure to reachdifferent filming biased condition.