Heat radiator for wafer encapsulation and its making method

A cooling fin and its manufacturing method which are used in wafer encapsulation, the cooling fin includes a noumenon made by the copper alloy material, a nickel-plate which is plated on the noumenon, a chromeplate layer which is plated on the nickel-plate, and an oxidizing layer which is below the noumenon. Because the chromium is easy to form passivity film, the effect of anticorrosion excels the nickel metal, plating the chromeplate layer on the surface of nickel-plate can make the cooling fin possesses more anticorrosion capability, so the phenomenon of rust-eaten to decrease the effect of cooling can be avoided, at the same time, because the cooling fin can not be corroded, so the rich-looking can be maintained.