Method and apparatus for pretreatment of polymeric materials

The present invention relates to a method and apparatus for pretreating a polymeric material in a treatment chamber (12). The method includes providing a polymeric material component into the treatment chamber (12) and introducing a carbon dioxide fluid in supercritical state therein. The component...

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Bibliographische Detailangaben
Hauptverfasser:	CONNERY KAREN ANNE, MAHL JERRY MICHAEL, BERGMAN THOMAS JOHN JR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CLEANING CLEANING IN GENERAL COMPOSITIONS BASED THEREON COMPOUNDS THEREOF ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS INORGANIC CHEMISTRY JOINING GLASS TO GLASS OR OTHER MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MINERAL OR SLAG WOOL NON-METALLIC ELEMENTS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SEPARATION SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method and apparatus for pretreating a polymeric material in a treatment chamber (12). The method includes providing a polymeric material component into the treatment chamber (12) and introducing a carbon dioxide fluid in supercritical state therein. The component is exposed to the carbon dioxide fluid to extract non-volatile organic residue contained in the component. The contaminated carbon dioxide fluid containing the extracted non-volatile organic residue is removed from the treatment chamber such that the organic residue does not deposit onto the polymeric material component by depressurizing the treatment chamber. Thereafter, the component is removed from the treatment chamber (12).