Package structure of photoelectric semiconductor
A packaging structure of a photoelectric semiconductor has the advantages of high heat conduction and formation at one run and more advanced than the known packaged structures, which mainly utilizes the method of formation at one run to improve the package intensity and heat conduction structure to...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A packaging structure of a photoelectric semiconductor has the advantages of high heat conduction and formation at one run and more advanced than the known packaged structures, which mainly utilizes the method of formation at one run to improve the package intensity and heat conduction structure to prevent over heat of the wafer |
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