Image sensor device and manufacturing method of the same
A metal exposing portion ( 12 ) exposed from a surface of a base ( 2 ) between an internal terminal portion ( 8 ) and an external terminal portion ( 9 ) is formed in a metal wiring ( 7 ) embedded in the base ( 2 ). Accordingly, in a case where a solder ball is not mounted on the external terminal po...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A metal exposing portion ( 12 ) exposed from a surface of a base ( 2 ) between an internal terminal portion ( 8 ) and an external terminal portion ( 9 ) is formed in a metal wiring ( 7 ) embedded in the base ( 2 ). Accordingly, in a case where a solder ball is not mounted on the external terminal portion ( 9 ), although a bled component flows from sealing resin along the upper surface of the base ( 2 ) during a manufacturing method, the bled component stops by the metal exposing portion ( 12 ) which function as a breakwater and thus the bled component can be prevented from covering the external terminal portion ( 9 ). |
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