Method for forming LED packaging substrate

Disclosed a method for manufacturing the packaging base plate of light-emitting diode comprises a silicon base plate which has a first surface, a second surface and a plurality of through holes. Wherein, the method utilizes the plasma strengthened chemical vapor deposition (PECVD) to form a insulati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DENG SHAOYOU, XIE ZHENGZHANG, CHEN ZEPENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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