Method for forming LED packaging substrate

Method for forming LED packaging substrate

Disclosed a method for manufacturing the packaging base plate of light-emitting diode comprises a silicon base plate which has a first surface, a second surface and a plurality of through holes. Wherein, the method utilizes the plasma strengthened chemical vapor deposition (PECVD) to form a insulati...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DENG SHAOYOU, XIE ZHENGZHANG, CHEN ZEPENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed a method for manufacturing the packaging base plate of light-emitting diode comprises a silicon base plate which has a first surface, a second surface and a plurality of through holes. Wherein, the method utilizes the plasma strengthened chemical vapor deposition (PECVD) to form a insulating layer to coat the first and second surfaces, and form a insulating collar to cover the inner walls of said a plurality of through holes, then form a conductive layer to cover said insulating layer and said insulating collar.