Heating device
PROBLEM TO BE SOLVED: To provide a heating device capable of improving degree of freedom in design of the device. SOLUTION: A heating chamber 126 for heating a circuit base 101 is formed in a reflow furnace 100. This heating device is provided with a pair of conveyance units 130, 140 provided in the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heating device capable of improving degree of freedom in design of the device. SOLUTION: A heating chamber 126 for heating a circuit base 101 is formed in a reflow furnace 100. This heating device is provided with a pair of conveyance units 130, 140 provided in the heating chamber 126 and conveying the circuit base 101 by holding end parts on both sides of the circuit base 101, a warping prevention unit 150 provided between the conveyance units 130 and 140 to prevent warping of the circuit base 101 by holding a substantially central part of the circuit base 101, and a support unit 160 for supporting the warping prevention unit 150 so as to move to a holding position for holding the substantially central part of the circuit base 101 and an evacuation position close to the conveyance unit 130 on one side and separating from the circuit base 101. COPYRIGHT: (C)2005,JPO&NCIPI |
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