Gap wall removing method and method for manufacturing MOS transistor
The invention is a method for removing gap walls, applied after formation of a metal oxide semiconductor (MOS) transistor that comprises grid on a substrate, gas walls on side walls of the grid and source and drain regions in the substrate on sides of the gas walls. And the method makes wet etching...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!