Abrasive compound for semiconductor planarization and manufacturing method thereof

A formatter for inscription of marks on to a 3D translucent optical medium to enable recording and retrieval of information from the medium, includes a clamping mechanism to hold the media, and at least one optical unit calibrated to focus at least one diffraction limited spot within the medium at a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	CHINONE KANSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	A formatter for inscription of marks on to a 3D translucent optical medium to enable recording and retrieval of information from the medium, includes a clamping mechanism to hold the media, and at least one optical unit calibrated to focus at least one diffraction limited spot within the medium at a respective depth therein. At least one light source is optimized for the inscription of marks, and at least one actuator moves the spot relative to the medium.