Method of forming bump pad of flip chip and structure thereof
Disclosed is a method of forming a bump pad of a flip chip and a structure thereof, characterized in that a resist pattern is formed through coating of a photosensitive material on an electroless copper plating layer, exposure to light and development, and then a bump pad is prepared by pulse platin...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Disclosed is a method of forming a bump pad of a flip chip and a structure thereof, characterized in that a resist pattern is formed through coating of a photosensitive material on an electroless copper plating layer, exposure to light and development, and then a bump pad is prepared by pulse plating and direct current plating of the resist pattern, thereby fabricating a substrate with a high density and high reliability. |
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