Composition for plating pure tin and electronic component employing the same

Composition for plating pure tin and electronic component employing the same

This invention discloses a composition of tin plating solution with pH ranging from 0.5-6.5, which comprises the following components: (1) one or more than one tin(II) compounds; (2) one or more than one organic acids; (3)one or more than one polyhydroxy compounds with two or more than two hydroxyl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN HONGMEI, LOU HONGTAO, CHEN MEI, LI JISEN, LAI YONGXIONG, ZHANG YIN, HUANG RONGSHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:This invention discloses a composition of tin plating solution with pH ranging from 0.5-6.5, which comprises the following components: (1) one or more than one tin(II) compounds; (2) one or more than one organic acids; (3)one or more than one polyhydroxy compounds with two or more than two hydroxyl groups; (4) one or more than one complexing agents; (5) one or more than one surfactants; and (6) one or more than one antioxidants. The composition of tin plating solution contains no lead, and all the organic ingredients are nontoxic and biodegradable. Electroplating solution is of good stability. The coating after electroplating is not easy to grow crystal whisker, and it is of low stress, half-bright and good ductility.