Package of possessing support piece for packing light sensitive semiconductor

Capsulation piece includes base plate, supporter of having accommodation space, packaging glue, at least one piece of chip and a cover piece. The preparing method includes following steps: setting up a supporter of having accommodation space on upper surface of the base plate; packaging glue formed on base plate for bonding outerwall of the supporter; then sticking one piece of chip on prearranged part in accommodation space, and connecting the chip to base plate electrically; sticking transparent cover piece onto the supporter and packaging glue; forming solder balls or contact pads on underside of base plate. Since the supporter is prearranged on base plate, thus packaging glue is suitable to capsulation procedure for different sizes by using single die. Advantages is preventing soldering fingers from pollution by die.