Semiconductor packaging structure and its manufacturing method

The invention is a semiconductor package structure, comprising a chip, plural connection pad extension circuits, plural through holes, an outer cover, and plural metallic circuits, where the chip has an active surface, a corresponding back, an optical element arranged on the active surface and plural pads arranged on the active surface and electrically connected to the optical element; the through hole passes through the chip and electrically connects to the connection pad extension circuits; the outer cover adheres to the active surface; the metallic circuits are arranged on the back of the chip and connects to the through holes and defines plural pads. The structure and manufacturing method thereof have higher sealing efficiency and overcomes many limits in the previous techniques.