Method for forming a micro-pattern on a substrate by using capillary force

In a method for forming a micro-pattern on a substrate by employing a mold having a predetermined pattern structure, a mold having a predetermined pattern structure containing a recessed portion and a protruded portion is prepared. A polymer material is deposited on the substrate. Then the protruded...

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Bibliographische Detailangaben
1. Verfasser:	LEE HONG-HIE,SUH KAB-YANG,KIM YOUN-SANG
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DECORATIVE ARTS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY MICROSTRUCTURAL TECHNOLOGY MOSAICS ORIGINALS THEREFOR PAPERHANGING PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PRODUCING DECORATIVE EFFECTS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TARSIA WORK TRANSPORTING
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Beschreibung
Zusammenfassung:	In a method for forming a micro-pattern on a substrate by employing a mold having a predetermined pattern structure, a mold having a predetermined pattern structure containing a recessed portion and a protruded portion is prepared. A polymer material is deposited on the substrate. Then the protruded portion of the mold is controlled to be in contact with the polymer material and the polymer material in contact with the protruded portion of the mold is incorporated into an empty space of the recessed portion thereof by using capillary force thereof, thereby removing the polymer material in contact with the protruded portion of the mold. Thereafter, a portion of the top surface of the substrate is exposed by detaching the mold to thereby form a polymer micro-pattern on the substrate.