Process for bonding two substrates together with the aid of a heat-activated thermoplastic adhesive and apparatus for making use of this process

The solid adhesive is placed in a tank (15) in which it melts to form a reserve of melt. The latter descends the walls (34, 35) of the tank towards the inlet (20) of a pump (16). A gas is transmitted at a pressure slightly above atmospheric pressure by a conduit (21) towards the air inlet. The liqui...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHARLES H. SCHOLL, DUANE O. SHUSTER, WILLIAM C. STUMPHAUZER, JOHN R. JANNER, JR
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The solid adhesive is placed in a tank (15) in which it melts to form a reserve of melt. The latter descends the walls (34, 35) of the tank towards the inlet (20) of a pump (16). A gas is transmitted at a pressure slightly above atmospheric pressure by a conduit (21) towards the air inlet. The liquid and the gas which enter simultaneously are mixed in the pump (16) and expelled under pressure into a conduit (22). The solution formed then passes through a filter (18), conduits (23) and a pipe (25) towards a dispenser gun at the outlet of which the solution forms a foam containing minuscule gas bubbles in the liquid. The bubbles grow and multiply when the stream moves away from the nozzle. Even after deposition on a substrate the beads continue to grow. This foam retains adhesiveness characteristics which are superior to those of the same adhesive when dispensed under the same conditions but without bubbles in the liquid.