Procédé pour former un revêtement résistant à la corrosion sur une bande d'acier et bande d'acier revêtue par ce procédé

An aqueous slurry containing Ni powder and optionally Cu and/or Sn is applied to a steel strip and sintered and then rolled to form a corrosion resistant coating. The steel strip may be vibrated during the application of the slurry may contain methyl cellulose and a surfactant as well as water. Part...

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Bibliographische Detailangaben
Hauptverfasser:	GRENVILLE HAYNES,FRANK, BRIAN ASHCROFT,THOMAS, NORMAN FLINT,GEORGES
Format:	Patent
Sprache:	fre
Schlagworte:	AUXILIARY PROCESSES IN PHOTOGRAPHY CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS POWDER METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	An aqueous slurry containing Ni powder and optionally Cu and/or Sn is applied to a steel strip and sintered and then rolled to form a corrosion resistant coating. The steel strip may be vibrated during the application of the slurry may contain methyl cellulose and a surfactant as well as water. Particles of ThO2 and Al2O3 ranging from 0.01 - 50 microns may be included in the slurry or a second slurry containing these oxides may be applied to the first Ni slurry. The steel strip may first be coated with Cu or Sn or up to 90% Cu may be included in the Ni slurry with or without Sn. The sintered coating is cold rolled and optionally resintered, annealed at 500 - 800 DEG C. and may then be electroplated with Cr. The layer of slurry may be rolled after drying and prior to sintering.