INTEGRATED CIRCUIT PACKAGE CONNECTORS

1412147 Two-part couplings BUNKER RAMO CORP 8 Nov 1972 [8 Nov 1971] 51602/72 Heading H2E Pads 15 on the lower surface of an I.C. package 12 (shown inverted in Fig. 3) abut the ends 22 of resilient contacts 21 which are so shaped and mounted that initial contact of the pads produces a pure rearward movement until a part of the contact engages part of its bore whereupon the contact is given a lateral wiping movement (Figs. 7 and 8). Mounting portions 45 of each contact are clamped by a back plate 50 and also have teeth 45a, 45b to dig into the body. The contacts are pre-stressed by engagement of portions 22, 47 (Fig. 7) and 49a, 49b (Fig. 6A) with the body. A lid (Fig. 2) has hooks 29-32 to engage the body (Fig. 4) and studs 43, 44 to hold the package 12 in place and apply even pressure to all the contacts. Alternatively (Fig. 11, not shown) the package 12 is held by screws (59, 60) and the lid is omitted. A recess 20 in the body accommodates a projection 17 housing the I.C. chip. Slots 53, 54 allow ventilation. Projections 25, 26 and holes 27, 28 ensure correct engagement and resist lateral displacement. To balance the lateral forces on the package 12, either the contact tips 22 of the two rows move in opposite directions or (Figs. 12- 14, not shown) alternate contact tips 22 in each row move in opposite directions. The back plate 50 is fixed to the body by heating and deforming the heads of posts 52.