FORCED FLOW COOLING TEMPERATURE CONTROL METHOD, SYSTEM, AND APPARATUS

An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plan...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TRACK, ELIE K, MCCUSKER, KELSEY, WAKAMIYA, STANLEY KATSUYOSHI, CHRISTIANSEN, MARTIN BROKNER, VAN SCIVER, STEVEN WARD
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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