DENSIFIED WOOD INCLUDING PROCESS FOR PREPARATION
A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressur...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressure are applied.
L'invention concerne un substrat ou un élément en bois ayant une densité accrue par rapport à du bois naturel et non traité. Le procédé consiste à sécher du bois avant une application de chaleur et de pression, qui sont commandées de façon à réduire voire éliminer un changement de couleur d'une surface de l'élément en bois là où sont appliquées la chaleur et la pression. |
---|