ABRASIVE ARTICLE AND METHOD FOR FORMING SAME

An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one electronic device. In an embodiment, the electronic assembly is...

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Bibliographische Detailangaben
Hauptverfasser:	JAYARAM, ROBIN CHANDRAS, HARALUR, GURULINGAMURTHY M, THANGAMANI, ARUNVEL
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one electronic device. In an embodiment, the electronic assembly is coupled to the abrasive body in a tamper-proof manner. L'invention concerne un article abrasif comprenant un corps abrasif comportant un matériau de liaison, des particules abrasives contenues dans le matériau de liaison et un ensemble électronique couplé au corps abrasif, l'ensemble électronique comprenant au moins un dispositif électronique. Selon un mode de réalisation, l'ensemble électronique est couplé au corps abrasif d'une manière inviolable.