FILM CUTTING DEVICE HAVING A LINEAR ACTUATOR

A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GEE, WILLIAM E, ZIEMAN, JONATHAN J, DOTSON, LARRY, LUND, JOHN, MCCARTY II, DONALD L, OCONNELL, PAUL
Format: Patent
Sprache:eng ; fre
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