FILM CUTTING DEVICE HAVING A LINEAR ACTUATOR
A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!