SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one...

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Bibliographische Detailangaben
Hauptverfasser:	HUMPHREY, BRET, SMITH, WAYNE, SHIVLAL, JANAKRAJ, HUMPHREY, ALAN E
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics. L'invention concerne une méthodologie et un milieu pour le nettoyage régulier et prévisible du matériel de support tel qu'un tube capillaire dans des éléments d'équipement d'ensemble semi-conducteur, tandis qu'il est toujours dans un assemblage manuel, semi-automatisé et automatisé. Le matériau de nettoyage peut comprendre une couche tampon de nettoyage et une ou plusieurs couches intermédiaires qui présentent des caractéristiques prédéfinies.