ESTABLISHING ELECTRONICS IN COMPOSITE PARTS BY LOCATING ELECTRONICS ON LAY-UP MANDRELS

A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the met...

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Bibliographische Detailangaben
Hauptverfasser:	HUMFELD, KEITH D, FAY, MATTHEW K
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AEROPLANES AIRCRAFT AVIATION CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COSMONAUTICS DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING ORREPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLYADAPTED FOR USE IN CONNECTION WITH AIRCRAFT HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFTCOMPONENTS, NOT OTHERWISE PROVIDED FOR HELICOPTERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.