THERMAL ENERGY DISSIPATION SYSTEMS AND METHODS

A system includes a housing (105) or enclosure for electrical components. The housing can include a base (106) and a lid (107) pivotably coupled to the base by one or more hinges (108,109). One or more heat-generating electrical components situated within the housing. One or more heat transfer devic...

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Bibliographische Detailangaben
Hauptverfasser:	RAHM, JAMES K, GORDON, JARED M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A system includes a housing (105) or enclosure for electrical components. The housing can include a base (106) and a lid (107) pivotably coupled to the base by one or more hinges (108,109). One or more heat-generating electrical components situated within the housing. One or more heat transfer devices (301,302,303,304) couple the housing to a thermal energy sink (207). The heat transfer devices transfer thermal energy generated by the one or more heat-generating electrical components from the housing to the thermal energy sink, thereby increasing the thermal dissipation capability of the housing.