METHOD FOR THE MANUFACTURE OF A TRANSMISSIVE OPTICAL SYSTEM

The invention relates to a method for producing a transmissive optics from a blank, wherein a material removal is achieved on the blank using an ablation laser and the pulse duration of the ablation laser is less than 1 ns and is preferably between 3 fs and 100 fs, or between 100 fs and 10 ps. L...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	VON WALLFELD, AXEL, POPRAWE, REINHART, CLASEN, UWE, FORNAROLI, CHRISTIAN, WILLENBORG, EDGAR, WEINGARTEN, CHRISTIAN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS POWDER METALLURGY PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a method for producing a transmissive optics from a blank, wherein a material removal is achieved on the blank using an ablation laser and the pulse duration of the ablation laser is less than 1 ns and is preferably between 3 fs and 100 fs, or between 100 fs and 10 ps. L'invention concerne un procédé de fabrication d'une optique à transmission à partir d'une ébauche. Selon ledit procédé, un enlèvement de matière est réalisé sur l'ébauche au moyen d'un laser d'enlèvement et la durée d'impulsion du laser d'enlèvement est inférieure à 1 ns et est comprise de préférence entre 3 fs et 100 fs ou entre 100 fs et 10 ps.