METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS

A puck (40) embedding at least one transmitter circuit, and a method (500) for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck (40) has a centrally located cavity, containing a carrier...

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Bibliographische Detailangaben
Hauptverfasser:	BOHN, BERNHARD JOHANN, HOLZNER, SIMON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AMUSEMENTS ANALOGOUS ARRANGEMENTS USING OTHER WAVES APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING,CLIMBING, OR FENCING BALL GAMES CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY GAMES GENERATION HUMAN NECESSITIES LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SPORTS SYSTEMS FOR STORING ELECTRIC ENERGY TESTING TRAINING EQUIPMENT TRANSMISSION
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Beschreibung
Zusammenfassung:	A puck (40) embedding at least one transmitter circuit, and a method (500) for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck (40) has a centrally located cavity, containing a carrier structure (11) having a rigid shell, at least one transmitter circuit (13) supported by the carrier structure (11), and a battery (12) provided within the carrier structure (11). The battery (12) is embedded in a first elastic material (21) provided within the carrier structure (11). The carrier structure (11) is embedded in a second elastic material (42) provided within the centrally located cavity. Il est décrit une rondelle (40) qui enrobe au moins un circuit de transmission ainsi quune méthode (500) de fabrication dune telle rondelle. La rondelle comprend une structure en couches afin de protéger les composantes électroniques contre les déplacements et les dommages. La rondelle (40) comprend une cavité centrale qui contient une structure de support (11) ayant une coque rigide, au moins un circuit de transmission (13) supporté par la structure de support (11) et une pile (12) située à lintérieur de la structure de support (11). La pile (12) est enrobée dun premier matériau élastique (21) situé à lintérieur de la structure de support (11). La structure de support (11) est enrobée dun deuxième matériau élastique (42) situé à lintérieur de la cavité centrale.