METHOD AND APPARATUS FOR ACCURATELY DISPENSING MATERIAL
Methods and apparatus are described for depositing materials at a precise location. The deposition is accomplished by using CNC control and a nozzle guide.
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | Methods and apparatus are described for depositing materials at a precise location. The deposition is accomplished by using CNC control and a nozzle guide. |
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