SYSTEM AND METHOD FOR FORMING BONDED SUBSTRATES

An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transpo...

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Bibliographische Detailangaben
Hauptverfasser:	KANUNGO, MANDAKINI, MCCONVILLE, PAUL J, ZHOU, JING, BEACHNER, JAMES R, JIA, NANCY Y, HONG, WEI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.