METHODS AND APPARATUS FOR APPLYING ADHESIVES IN PATTERNS TO AN ADVANCING SUBSTRATE

Aspects of the methods and apparatuses (100) herein involve applying fluids onto an advancing substrate (106). The apparatuses (100) and methods herein may provide for the application of viscous fluids (130), such as adhesives, in pre-determined patterns to an advancing substrate (106). The fluid ap...

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Bibliographische Detailangaben
Hauptverfasser:	BROWN, DARRELL IAN, STRASEMEIER, JOHN ANDREW
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BANDAGES, DRESSINGS OR ABSORBENT PADS DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION HUMAN NECESSITIES HYGIENE MEDICAL OR VETERINARY SCIENCE ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PERFORMING OPERATIONS PROSTHESES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS
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Beschreibung
Zusammenfassung:	Aspects of the methods and apparatuses (100) herein involve applying fluids onto an advancing substrate (106). The apparatuses (100) and methods herein may provide for the application of viscous fluids (130), such as adhesives, in pre-determined patterns to an advancing substrate (106). The fluid application apparatus may include a slot die applicator (102) and a substrate carrier (104). The slot die applicator(102) may include a slot opening (114), a first lip (116), and a second lip (118), the slot opening (114) located between the first lip (116) and the second lip (118). And the substrate carrier (104) may be adapted to advance the substrate (106) past the slot die applicator (102) as the slot die applicator (102) discharges adhesive onto the substrate (106). In operation, when a first surface (108) of the substrate (106) is disposed on the substrate carrier (104), the substrate carrier 104) advances a second surface (110) of the substrate past the slot opening (114) of the slot die applicator (104).