APPARATUS AND METHOD FOR THERMAL STABILIZATION OF PCB-MOUNTED ELECTRONIC COMPONENTS WITHIN AN ENCLOSED HOUSING

The invention is directed to an apparatus and method. The apparatus comprises a matrix of thermoelectric devices configured to set thermal gradients across an electronic component within a housing; a matrix of thermosensitive devices configured to measure thermal gradients associated with the electronic component; and a controller configured to control the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices. The controller is configured to identify an average thermal gradient associated with an external ambient temperature measured over a given time period, to stabilize a temperature within the housing by establishing a temperature set-point above the average thermal gradient, and to maintain the temperature within the housing at the temperature set-point so that the temperature within the housing remains above the average thermal gradient.