60 GHZ INTEGRATED CIRCUIT TO PRINTED CIRCUIT BOARD TRANSITIONS

Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to...

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Bibliographische Detailangaben
Hauptverfasser:	GU, HUANHUAN, DEVRIES, CHRISTOPHER, REPETA, MORRIS, KANJ, HOUSSAM
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES WIRELESS COMMUNICATIONS NETWORKS
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Beschreibung
Zusammenfassung:	Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure. Des modes de réalisation concernent une structure de transition dinterface dune puce de circuit intégré et dun substrat comprenant ce qui suit : une structure de guide dondes coplanaire formée en fonction des coussinets sol-signal-sol sur la puce de circuit intégré, une structure de guide dondes coplanaire mise à la masse couplée aux coussinets sol-signal-sol, et une ligne microruban couplée à la structure de guide dondes coplanaire mise à la masse.